Industrial photonics packaging for high volume applications

Milan M. Milosevic; Zerihun G. Tegegne; Chunting Zhong; David van Duinen; Xin Yin; Johan Bauwelinck; Maria Massaouti; Efstathios Andrianopoulos; Panos Groumas; Michael Theurer; Durvasa Y. Gupta; Martin Kresse; Madeleine Weigel; David de Felipe; Norbert Keil; Joost van Kerkhof

doi:10.1117/12.3000934

11 March 2024 Industrial photonics packaging for high volume applications

Milan M. Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Kresse, Madeleine Weigel, David de Felipe, Norbert Keil, Joost van Kerkhof

Author Affiliations +

Proceedings Volume 12892, Optical Interconnects XXIV; 128920M (2024) https://doi.org/10.1117/12.3000934
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

Commercial introduction of emerging integrated photonics technologies requires a long and complex multi-layer product development, industrialization, and qualification cycles at all levels of value chain from initial product design, material sourcing, component-system-module manufacturing, and testing, through marketing and delivery of new products to the market. Scalable assembly and packaging of electronic-photonic integrated modules is important and may take more than a half of the entire product’s costs. In this paper, we will report on some of our industrial processes for scalable photonics packaging, as well as challenges and results obtained from our research and innovation projects.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

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Milan M. Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Kresse, Madeleine Weigel, David de Felipe, Norbert Keil, and Joost van Kerkhof "Industrial photonics packaging for high volume applications", Proc. SPIE 12892, Optical Interconnects XXIV, 128920M (11 March 2024); https://doi.org/10.1117/12.3000934

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