Poster + Paper
9 April 2024 High-accuracy wafer topography sensor using optical spectroscopy and correction based on an optical model
Author Affiliations +
Conference Poster
Abstract
Nikon has developed a state-of-the-art wafer topography sensor dubbed S-meter-Z, which is based on an optical spectroscopy and novel correction function based on an optical model. The measurement repeatability is roughly 10 nm and has the potential to reach down to a few nm with additional improvements. Processed wafers with lithography patterns often have a complicated surface film structure, which induces the amplitude change and phase shift of the reflected light. This phase shift often causes errors in wafer topography measurement. The S-meter-Z minimizes these errors and provides accurate wafer geometry data for wafer process monitoring, which is essential for manufacturing today’s leading-edge microchip devices.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Ryohei Niwata, Tadashi Nagayama, Kota Dobashi, Kensuke Yoshinaga, and Satoshi Takahashi "High-accuracy wafer topography sensor using optical spectroscopy and correction based on an optical model", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 1295525 (9 April 2024); https://doi.org/10.1117/12.3009791
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KEYWORDS
Semiconducting wafers

Optical sensors

Film thickness

Wafer bonding

Optical alignment

Deformation

Sensors

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