Packaging technology of very long wavefront array infrared detectors working in deep low temperature

Zhihao Fang; Zhikai Fu; Guan Wang; Lei Zhang

doi:10.1117/12.3013181

30 April 2024 Packaging technology of very long wavefront array infrared detectors working in deep low temperature

Zhihao Fang, Zhikai Fu, Guan Wang, Lei Zhang

Proceedings Volume 13157, Sixth Conference on Frontiers in Optical Imaging and Technology: Applications of Imaging Technologies; 1315703 (2024) https://doi.org/10.1117/12.3013181
Event: Sixth Conference on Frontiers in Optical Imaging Technology and Applications (FOI2023), 2023, Nanjing, JS, China

Abstract

Based on the demand of working environments below liquid nitrogen temperature for very long wave infrared detectors, this article proposes a kind of packaging technology for deep low-temperature working very long wave infrared detectors. Through innovative optimization design of the heat leakage and the chip electrical lead structure of the dewar, the static thermal load of the entire dewar can be controlled to be 0.65W when the chip is operating at a low temperature of 30K, and the static thermal load at the coldest end position is 0.3W, The cooling capacity of the two-stage pulse tube refrigerator that is compatible with the dewar can meet the above thermal load requirement. We have completed the packaging test of the detector component, and the results show that under the air cooling test condition of the refrigerator expander’s hot end, the detector chip can work in the temperature of 30K; the outer contour of the dewar is < Φ 130mmx180mm. This technological achievement greatly promotes the advancement of packaging technology for very long wave array infrared detectors operating at deep and low temperature.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Zhihao Fang, Zhikai Fu, Guan Wang, and Lei Zhang "Packaging technology of very long wavefront array infrared detectors working in deep low temperature", Proc. SPIE 13157, Sixth Conference on Frontiers in Optical Imaging and Technology: Applications of Imaging Technologies, 1315703 (30 April 2024); https://doi.org/10.1117/12.3013181

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KEYWORDS

Packaging

Design

Infrared detectors

Dielectrics

Sensors

Detector arrays

Lead

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