Paper
1 December 1990 Stress-related phenomena in reactively dc-magnetron-sputtered aluminum nitride thin films
Roland Zarwasch, H. Oefner, Eduard P. Rille, Hans K. Pulker
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Abstract
Aluminum nitride films were deposited on fused silica by reactive dc magnetron sputtering from an Al-target in an Ar/N2 atmosphere. In-situ measurements during the deposition provide data concerning mechanical stresses inherent to the growing thin films. By variation of both the composition of the sputtering gas (Ar,N2) and the total gas flow in the vacuum chamber, the occuring intrinsic stresses could be shifted in magnitude and direction. Stress values of the thin films ranged from -1.2GPa (compressive) to +1.2GPa (tensile) when the Ar/N2 ratio was varied between 3:1 and 1:3 for the different total gas flows of 5Osccm, lOOsccm, and 200sccm (corresponding to total gas pressures of approximately 2x101Pa, 4x101Pa, and 8x101Pa respectively). Investigation of optical film properties, such as refractive index, as well as of structural properties were carried out and the results were related to the state of stress the films were in. The optical characterization (n,k) was achieved by photospectrometry. Structure and chemical composition were analysed by electron diffraction,transmission electron microscopy (ThM) and Auger electron spectroscopy (AES) respectively.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Roland Zarwasch, H. Oefner, Eduard P. Rille, and Hans K. Pulker "Stress-related phenomena in reactively dc-magnetron-sputtered aluminum nitride thin films", Proc. SPIE 1324, Modeling of Optical Thin Films II, (1 December 1990); https://doi.org/10.1117/12.22431
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KEYWORDS
Sputter deposition

Thin films

Nitrogen

Refractive index

Aluminum

Transmission electron microscopy

Aluminum nitride

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