Application of real-time holographic interferometry in the nondestructive inspection of electronic parts and assemblies

Craig P. Wood; James D. Trolinger

doi:10.1117/12.51064

1 January 1991 Application of real-time holographic interferometry in the nondestructive inspection of electronic parts and assemblies

Craig P. Wood, James D. Trolinger

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Proceedings Volume 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection; (1991) https://doi.org/10.1117/12.51064
Event: 34th Annual International Technical Symposium on Optical and Optoelectronic Applied Science and Engineering, 1990, San Diego, CA, United States

Abstract

Nondestructive inspection by holographic interferometry (HI) is quickly gaining acceptance in the electronics industry as a sensitive and accurate method of locating manufacturing and assembly flaws in a wide range of electronics, from individual components to assembled modules. This paper describes the specific application of real-time HI in the nondestructive analysis of circuit board heat exchangers and multiple-layer printed wiring boards to locate areas of debonding and delamination. In the application of HI, the choice of a stressing method is often as important as the choice of a specific HI technique. Methods for component stressing include thermal, vibrational, and pressure-induced stressing methods, and these are described in detail. In addition, two techniques for sensitivity enhancement, phase shift interferometry and beam tilt correction, are discussed in detail.

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Craig P. Wood and James D. Trolinger "Application of real-time holographic interferometry in the nondestructive inspection of electronic parts and assemblies", Proc. SPIE 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection, (1 January 1991); https://doi.org/10.1117/12.51064

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KEYWORDS

Holographic interferometry

Holograms

Inspection

Holography

Fringe analysis

Nondestructive evaluation

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