Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits

Neven Orhanovic; Leonard A. Hayden; Vijai K. Tripathi

doi:10.1117/12.25529

1 April 1991 Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits

Neven Orhanovic, Leonard A. Hayden, Vijai K. Tripathi

Author Affiliations +

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25529
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Analytical and numerical techniques formulated to model uniform and nonuniform lines are used to compute signal delays distortion and crosstalk in interconnects and packaging. The techniques presented include the use of CAD compatible circuit models and computational techniques based on time and frequency domain solution of multiconductor lossy interconnects. Typical numerical results for the pulse propagation characteristics of uniformly and nonuniformly coupled interconnects are presented.

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Neven Orhanovic, Leonard A. Hayden, and Vijai K. Tripathi "Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25529

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