Effects of packaging and interconnect technology on testability of printed wiring boards

Joseph L.A. Hughes; Prem Pahlajrai

doi:10.1117/12.25512

1 April 1991 Effects of packaging and interconnect technology on testability of printed wiring boards

Joseph L.A. Hughes, Prem Pahlajrai

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25512
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Continuing improvements in packaging and interconnect technology have made it increasingly difficult to adequately test printed wiring board (PWB) assemblies. Traditional PWB test methods depend on both the relatively small number of components on the board and easy access to the interconnection signal paths. This paper surveys options for verifying correct logical behavior (i. e. ''functional" or " digital'' testing) of state-of-the-art PWBs. Design for Testability (DFT) methods for enhancing circuit observability and controllability are described along with extensions of these methods for board-level testing (such as Built-In Self-Test and the IEEE/JTAG Boundary Scan standard). Testability problems are likely to increase as new packaging and interconnect technologies using ceramics and polyimides further increase circuit density and complexity. This paper considers the impact of these technology advances on current testing strategies and potential alternative methodologies.

Citation Download Citation

Joseph L.A. Hughes and Prem Pahlajrai "Effects of packaging and interconnect technology on testability of printed wiring boards", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25512

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