Novel microstructures for low-distortion chip-to-chip interconnects

Heinrich C. Blennemann; Roger Fabian W. Pease

doi:10.1117/12.25525

1 April 1991 Novel microstructures for low-distortion chip-to-chip interconnects

Heinrich C. Blennemann, Roger Fabian W. Pease

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25525
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

To shift the onset of skin resistance in off-chip interconnects novel microstructures are proposed as a method to maximize conductor surface area for a given pitch. We consider lines of Scm length operating at 1GHz with ~6dB attenuation. Assuming thin but wide lines (aspect ratio 10:1) for low distortion then conventional microstrip lines would require a 5Oim pitch theoretical study shows that a vertical coplanar line essentially a tall double-strip coplanar line could be packed twice as densely. Circuit theory and field theory which accounts for fringing are used to predict a reduction in high frequency resistance in laminated microstrip lines as well. Reduction in resistance was observed in a large-scale model of a transposed multiple-conductor microstrip line. Microfabrication of phase-velocity matched laminated lines demonstrated the difficulty of matching material constants emphasizing the relative strength of transposed laminated lines which do not require matching.

Citation Download Citation

Heinrich C. Blennemann and Roger Fabian W. Pease "Novel microstructures for low-distortion chip-to-chip interconnects", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25525

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