Proposed electro-optic package with bidirectional lensed coupling

K. Rajasekharan; Timothy Michalka

doi:10.1117/12.25557

1 April 1991 Proposed electro-optic package with bidirectional lensed coupling

K. Rajasekharan, Timothy Michalka

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25557
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Optical packages with multiple optical I/Os and without optical pigtails or conventional connectors are proposed. These conceptual packages are of a hybrid PGA style with LSI chips and arrays of optical sources and detectors. A central theme is the use of only moderate extensions of current single chip and PWB packaging technologies. The light coupling between devices and waveguides is to be achieved using an array of lenses and/or microprisms. The feasibility of such a package is discussed from engineering manufacturing and repairability viewpoints.

Citation Download Citation

K. Rajasekharan and Timothy Michalka "Proposed electro-optic package with bidirectional lensed coupling", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25557

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