Sensitivity study of printed wiring board plated-through-holes copper barrel voids

Chao-Pin Yeh; Charles Umeagukwu; Robert E. Fulton; William Teat

doi:10.1117/12.25522

1 April 1991 Sensitivity study of printed wiring board plated-through-holes copper barrel voids

Chao-Pin Yeh, Charles Umeagukwu, Robert E. Fulton, William Teat

Proceedings Volume 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies; (1991) https://doi.org/10.1117/12.25522
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Improved printed wiring board (PWB) manufacturing technology has resulted in more advanced methods for component mounting (such as surface mount technology). Evidence has shown that the new generation of PWBs cannot be built using surface mount technology (SMT) alone. Some passive components and connectors can only be mounted by using plated through holes (PTHs) and vias. Up to now PTHs and vias are still the most widely used inter-layer connections in a PWB. The advanced miniaturization technologies has dramatically reduced the size of a PTH to as small as 5mils and the use of multilayer composite construction further increases the level of design complexity. It has been determined that PTH failure results from thermo-mechanical deformation due to mismatch of coefficients of thermal expansion (CTE) in the out-of-plane (Z) direction between board substrate and the PTH copper plating at elevated temperatures. Although many studies have been conducted concerning the general PTH design what has not yet been evaluated in a systematic and comprehensive manner is the PWB failure resulting from copper barrel plating voids. A collaborative research effort between Georgia Tech and Motorola has recently been carried out to investigate the influence of voids on PTH failures. This study first identifies the basic key design parameters (such as void size void shape void location copper plating thickness etc. ) relevant to void characterization. These parameters with selected values were collectively formed a

Citation Download Citation

Chao-Pin Yeh, Charles Umeagukwu, Robert E. Fulton, and William Teat "Sensitivity study of printed wiring board plated-through-holes copper barrel voids", Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); https://doi.org/10.1117/12.25522

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