Projection direct imaging for high-density interconnection and printed circuit manufacture

Neil G. Bergstrom

doi:10.1117/12.25605

1 April 1991 Projection direct imaging for high-density interconnection and printed circuit manufacture

Neil G. Bergstrom

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25605
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

Projection direct imaging uses a laser-written liquid crystal light valve serving as an erasable mask to create multiple copies on photoresist coated substrates using projection photolithography. This technology is applicable to printed circuit manufacture high-density electronic interconnection and packaging.

Citation Download Citation

Neil G. Bergstrom "Projection direct imaging for high-density interconnection and printed circuit manufacture", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25605

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