Skin effect in high-speed ULSI/VLSI packages

Lih-Tyng Hwang; Iwona Turlik

doi:10.1117/12.25581

1 April 1991 Skin effect in high-speed ULSI/VLSI packages

Lih-Tyng Hwang, Iwona Turlik

Proceedings Volume 1390, Microelectronic Interconnects and Packages: System and Process Integration; (1991) https://doi.org/10.1117/12.25581
Event: Advances in Intelligent Robotics Systems, 1990, Boston, MA, United States

Abstract

As the rise time of digital pulses is reduced to the subnanosecond range the skin effect becomes an important issue in high-speed digital systems. In this paper the various approaches (theoretical and experimental) which have been taken to study the skin effect are surveyed. Various methods that accommodate the skin effect phenomenon into conductor design rules for high-speed digital systems are examined and compared. The resulting impact of these accommodations on high performance ULSI/VLSI multichip packages is addressed.

Citation Download Citation

Lih-Tyng Hwang and Iwona Turlik "Skin effect in high-speed ULSI/VLSI packages", Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); https://doi.org/10.1117/12.25581

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