Performance of through-the-lens/off-axis laser alignment systems and alignment algorithms on Nikon wafer steppers

Nigel R. Farrar; Frederik Sporon-Fiedler

doi:10.1117/12.59806

1 June 1992 Performance of through-the-lens/off-axis laser alignment systems and alignment algorithms on Nikon wafer steppers

Nigel R. Farrar, Frederik Sporon-Fiedler

Author Affiliations +

Proceedings Volume 1673, Integrated Circuit Metrology, Inspection, and Process Control VI; (1992) https://doi.org/10.1117/12.59806
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

New generations of ULSI devices require significant improvements in circuit overlay. The performance limits of a current wafer stepper alignment system have been evaluated by testing alignment target capture on planarized targets and rough substrates. Although new hardware is being developed for alignment under difficult conditions, it has been shown that new algorithm designs can extend the performance of existing systems.

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Nigel R. Farrar and Frederik Sporon-Fiedler "Performance of through-the-lens/off-axis laser alignment systems and alignment algorithms on Nikon wafer steppers", Proc. SPIE 1673, Integrated Circuit Metrology, Inspection, and Process Control VI, (1 June 1992); https://doi.org/10.1117/12.59806

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