Conceptual monolithic pad grid array connector for transducer interconnects

Scott S. Corbett III; Robert F. Stanton

doi:10.1117/12.130603

5 November 1992 Conceptual monolithic pad grid array connector for transducer interconnects

Scott S. Corbett III, Robert F. Stanton

Proceedings Volume 1733, New Developments in Ultrasonic Transducers and Transducer Systems; (1992) https://doi.org/10.1117/12.130603
Event: San Diego '92, 1992, San Diego, CA, United States

Abstract

In this paper we describe and demonstrate a unique termination scheme whereby an array of coaxial wires is efficiently fabricated into a monolithic substrate resulting in a two-dimensional array structure forming a pad grid array connector. This structure has significant implications for high density cable interconnect applications in ultrasound transducer systems, circuit board and hybrid interconnect structures. A connector concept is proposed in which the interconnect is used as an in-line connector for a user-friendly transducer probe interconnect system. Future applications of the connector are described including use as an integrated substrate onto which both one and two-dimensional arrays can be fabricated or connected. Results including electrical testing are shown for a 12.7 mm (0.5') diameter, 100 position, 0.6 mm (.25') center-to-center rectilinear pad array connector utilizing 40 gauge 50 (Omega) coaxial wires.

Citation Download Citation

Scott S. Corbett III and Robert F. Stanton "Conceptual monolithic pad grid array connector for transducer interconnects", Proc. SPIE 1733, New Developments in Ultrasonic Transducers and Transducer Systems, (5 November 1992); https://doi.org/10.1117/12.130603

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