Paper
15 September 1993 Role of surface tension in silylation processes
Andre P. Weill, Patrick Jean Paniez, Olivier P. Joubert, Francoise Debaene, Daniel Sage, Gilles R. Amblard, Michel J. Pons
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Abstract
The DESIRER process has been proposed as an attractive solution to lithographic problems, combining the performance of multilayer systems to the simplicity of monolayer processes. Despite the large number of studies devoted to this type of process, the various mechanisms involved during the silylation and dry development steps are not yet totally understood. The first part of the paper deals with the changes in solubility of the resist layer before and after silylation and suggests that the polarity of the resist is modified during the process. Surface tension measurements are then reported in order to quantitatively evaluate the changes in polarity of the silylated resist. Finally it is shown that the work of adhesion between silylated and non-silylated material can easily explain both the stability of the silylated islands during the HMDS process and the motion of these silylated areas during the dry development step.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andre P. Weill, Patrick Jean Paniez, Olivier P. Joubert, Francoise Debaene, Daniel Sage, Gilles R. Amblard, and Michel J. Pons "Role of surface tension in silylation processes", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); https://doi.org/10.1117/12.154759
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Cited by 1 scholarly publication.
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KEYWORDS
Liquids

Plasma

Photoresist processing

Polymers

Thermodynamics

Plasma etching

Thermal effects

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