Vertical-cavity surface-emitting lasers for flip-chip packaged vertical optical interconnects

Sean S. O'Keefe; William J. Schaff; Lester Fuess Eastman

doi:10.1117/12.177330

3 June 1994 Vertical-cavity surface-emitting lasers for flip-chip packaged vertical optical interconnects

Sean S. O'Keefe, William J. Schaff, Lester Fuess Eastman

Proceedings Volume 2216, Photonics at the Air Force Photonics Center; (1994) https://doi.org/10.1117/12.177330
Event: SPIE's International Symposium on Optical Engineering and Photonics in Aerospace Sensing, 1994, Orlando, FL, United States

Abstract

Vertical cavity surface emitting lasers (VCSELs) have been fabricated and studied as the optical sources in a vertical optical interconnect application. The VCSELs are to replace LEDs that are currently used in a proof-of-concept demonstration. The advantages of VCSELs ares better power efficiency as sources, higher optical powers, focused beam output, monochromatic operation, and higher modulation bandwidth. The VCSELs used in this project are the first to implement continuously sinusoidally graded interface mirrors grown by molecular beam epitaxy. material parameters, device results, and interconnect implications are presented.

Citation Download Citation

Sean S. O'Keefe, William J. Schaff, and Lester Fuess Eastman "Vertical-cavity surface-emitting lasers for flip-chip packaged vertical optical interconnects", Proc. SPIE 2216, Photonics at the Air Force Photonics Center, (3 June 1994); https://doi.org/10.1117/12.177330

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