Patterned eutectic bonding with Al/Ge thin films for MEMS

Paul M. Zavracky; Bao Vu

doi:10.1117/12.221299

19 September 1995 Patterned eutectic bonding with Al/Ge thin films for MEMS

Paul M. Zavracky, Bao Vu

Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221299
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

In this paper, we report our results using eutectic bonding with the aluminum/germanium alloy to create high quality bonds. The results of a series of experiments conducted to optimize eutectic alloy bonding for MEMS are described. Issues discussed include surface preparation, eutectic composition, bonding apparatus and bonding conditions (temperature and time).

Citation Download Citation

Paul M. Zavracky and Bao Vu "Patterned eutectic bonding with Al/Ge thin films for MEMS", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221299

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