Development of high-speed IR sensor chip technologies

Michael J. Dahlin; Alan W. Hoffman; J. L. West; Roger West; J. Santana; S. Ortega; S. Byers; David A. Thiede; S. Bailey; E. Herrin; M. Levy; R. Parlato; N. Maassen

doi:10.1117/12.243537

26 June 1996 Development of high-speed IR sensor chip technologies

Michael J. Dahlin, Alan W. Hoffman, J. L. West, Roger West, J. Santana, S. Ortega, S. Byers, David A. Thiede, S. Bailey, E. Herrin, M. Levy, R. Parlato, N. Maassen

Author Affiliations +

Proceedings Volume 2745, Infrared Readout Electronics III; (1996) https://doi.org/10.1117/12.243537
Event: Aerospace/Defense Sensing and Controls, 1996, Orlando, FL, United States

Abstract

Data collection for Earth resources applications requires sensors with high sensitivity, moderately high scan rates, large dynamic range, and excellent calibratability and stability. In addition, multispectral or hyperspectral capabilities are highly desirable to enhance scene discrimination, chemical species identification, and temperature measurement performance. These sensors must also have small size, light weight, low power, reduced thermal load, and simple electronic interface characteristics for improved mission performance. A collection of focal plane technologies is currently being developed to meet these requirements: (1) High-speed (18 kHz) 224-channel scanning InSb sensor chip assembly with 52 in TDI. (2) On-SCA 450- channel, 24-kHz, 12-bit A/D converter. (3) 208-color SWIR- MWIR hyperspectral and 3-color SWIR-MWIR multispectral solid-state spectrometers. (4) Cryogenic digital optic data links. Prototype components have been fabricated. Initial performance measurements have successfully demonstrated the feasibility of these emerging focal plane technologies.

Citation Download Citation

Michael J. Dahlin, Alan W. Hoffman, J. L. West, Roger West, J. Santana, S. Ortega, S. Byers, David A. Thiede, S. Bailey, E. Herrin, M. Levy, R. Parlato, and N. Maassen "Development of high-speed IR sensor chip technologies", Proc. SPIE 2745, Infrared Readout Electronics III, (26 June 1996); https://doi.org/10.1117/12.243537

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