Critical dimension metrology for MEMS processes using electrical techniques

Richard A. Allen; Janet C. Marshall

doi:10.1117/12.250946

13 September 1996 Critical dimension metrology for MEMS processes using electrical techniques

Richard A. Allen, Janet C. Marshall

Proceedings Volume 2880, Microlithography and Metrology in Micromachining II; (1996) https://doi.org/10.1117/12.250946
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

Electrical critical dimension (ECD) test structures have been adapted for use in a surface micromachining environment and fabricated along side various MicroElectroMechanical Systems (MEMS) structures. These freestanding ECD test structures, which are exposed to air on all surfaces (that is, no encompassing oxide), provide the ability to measure two key metrological process parameters, sheet resistance and feature width, that can affect the threshold at which released fixed-fixed beam MEMS structures experience deflection due to residual compressive strain.

Citation Download Citation

Richard A. Allen and Janet C. Marshall "Critical dimension metrology for MEMS processes using electrical techniques", Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); https://doi.org/10.1117/12.250946

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