Laser micromachining: a promise of cost-effective solutions in microelectronic manufacturing

Ronald D. Schaeffer; James Angell

doi:10.1117/12.273729

9 May 1997 Laser micromachining: a promise of cost-effective solutions in microelectronic manufacturing

Ronald D. Schaeffer, James Angell

Proceedings Volume 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II; (1997) https://doi.org/10.1117/12.273729
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

Lasers have been used in industry for well over 20 years and are currently found in many application areas including welding, cutting, drilling, surface modifying and material removal. The general industry trend has been toward high power lasers for macro applications, frequently involving metal working. More recently a major shift in emphasis has been made by some manufacturers to more fully investigate the feasibility of using lasers for the purposes of what we describe as 'micromachining.' In general this involves working with material of limited bulk and thickness (less than 1 mm) and where feature sizes are also on the order of several mm maximum. This talk will briefly describe the advantages and disadvantages of several laser types and the components of turn-key, laser based micromachining systems. Many successful applications are presented and discussed including material processing of ceramics, CVD, diamond, plastics and thin metals, used in industries such as micromedical devices and microelectronic manufacturing.

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Ronald D. Schaeffer and James Angell "Laser micromachining: a promise of cost-effective solutions in microelectronic manufacturing", Proc. SPIE 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II, (9 May 1997); https://doi.org/10.1117/12.273729

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KEYWORDS

Manufacturing

Laser processing

Metals

Micromachining

Excimer lasers

Carbon dioxide lasers

Diamond

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