Micromachining of microelectronic materials with deep-UV lasers

Hans Kurt Toenshoff; Ferdinand von Alvensleben; Heiner Kappel; Peter B. Heekenjann

doi:10.1117/12.273726

9 May 1997 Micromachining of microelectronic materials with deep-UV lasers

Hans Kurt Toenshoff, Ferdinand von Alvensleben, Heiner Kappel, Peter B. Heekenjann

Proceedings Volume 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II; (1997) https://doi.org/10.1117/12.273726
Event: Photonics West '97, 1997, San Jose, CA, United States

Abstract

Micromachining requires very precise tools with high resolution. Lasers emitting electromagnetic radiation in the ultraviolet (UV) region offer focussed spot sizes less than one micrometer. Wavelengths in the range of lambda equals 200 to 280 nm are called deep ultraviolet (DUV) and ensure minimal resolution for actual and future application in microelectronics. Conventional DUV-lasers are the well developed excimer-lasers and frequency converted systems such as Nd:YLF, Nd:YAG and Ar+-lasers. DUV-lasers can be used for submicron single pulse machining up to processing of complex surfaces for the great variety of microelectronic components. The process efficiency is determined not only by the choice of the laser source itself, but also by the system technology such as optical elements for beam shaping and guidance or workpiece handling. Besides the system technology, the choice of an appropriate laser and handling system ensures an efficient processing and repair of microelectronic components. The presented examples cover the direct writing of conductive layers on ceramic material in combination with electroplating, which offers ways of rapid prototyping printed circuit boards (PCB). Furthermore, the repair of expensive electronic products is of growing interest. Examples are the repair of photolithography masks. An overview of further opportunities using DUV-lasers is given by 3D structuring of glass and ceramics.

Citation Download Citation

Hans Kurt Toenshoff, Ferdinand von Alvensleben, Heiner Kappel, and Peter B. Heekenjann "Micromachining of microelectronic materials with deep-UV lasers", Proc. SPIE 2991, Laser Applications in Microelectronic and Optoelectronic Manufacturing II, (9 May 1997); https://doi.org/10.1117/12.273726

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