Projection moire for 3D inspection of printed circuit boards

Seung-Woo Kim; Yi-Bae Choi; Jung-Taek Oh

doi:10.1117/12.269750

21 March 1997 Projection moire for 3D inspection of printed circuit boards

Seung-Woo Kim, Yi-Bae Choi, Jung-Taek Oh

Proceedings Volume 3023, Three-Dimensional Image Capture; (1997) https://doi.org/10.1117/12.269750
Event: Electronic Imaging '97, 1997, San Jose, CA, United States

Abstract

We present a method of projection moire specially devised for the three-dimensional inspection of printed circuit boards. This method incorporates phase-shifting technique in analyzing moire fringes so as to achieve a fine resolution of 1 micron in height measurement. Further a synchronous grating translation scheme enhances the lateral measuring resolution by inherently removing the original pattern of the reference grating in resulting moire fringes. Finally we discuss the advantages of the proposed method using several measurement results performed on the various types of solder paste silk-screened on printed circuit boards.

Citation Download Citation

Seung-Woo Kim, Yi-Bae Choi, and Jung-Taek Oh "Projection moire for 3D inspection of printed circuit boards", Proc. SPIE 3023, Three-Dimensional Image Capture, (21 March 1997); https://doi.org/10.1117/12.269750

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