Yield management and reticle defects

Kent B. Ibsen; Mark D. Eickhoff; Z. Mark Ma; Sonya Yvette Shaw; Steven D. Carlson; H. Tomomatsu

doi:10.1117/12.275972

7 July 1997 Yield management and reticle defects

Kent B. Ibsen, Mark D. Eickhoff, Z. Mark Ma, Sonya Yvette Shaw, Steven D. Carlson, H. Tomomatsu

Proceedings Volume 3051, Optical Microlithography X; (1997) https://doi.org/10.1117/12.275972
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

There are an increasing number of issues confronting lithography engineers in modern wafer fabs. Of these problems, yield loss due to reticle defects has received less attention as compared to the shrinking process window of advanced lithographic requirements. Wafer fabs also have concentrated primarily on equipment and people as major sources of yield loss. The requirement of increased focus on reticle defects is examined. The constraints of the current manufacturing capability of mask shops is driving the need for a better method to link the actual lithographic manufacturing process to the reticle defect analysis. This paper will propose a method for integrating the reticle inspection and wafer process as a method for advanced reticle disposition and specification generation. By linking the fab wafer process to the reticle defect inspection a more complete picture of the impact of having reticle defects can be assessed.

Citation Download Citation

Kent B. Ibsen, Mark D. Eickhoff, Z. Mark Ma, Sonya Yvette Shaw, Steven D. Carlson, and H. Tomomatsu "Yield management and reticle defects", Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); https://doi.org/10.1117/12.275972

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