Statistical analysis on the measuring resolution of edge position by digital imaging

Seung-Woo Kim; SangYoon Lee; Jeong Kwan Lee

doi:10.1117/12.294524

12 December 1997 Statistical analysis on the measuring resolution of edge position by digital imaging

Seung-Woo Kim, SangYoon Lee, Jeong Kwan Lee

Proceedings Volume 3173, Ultrahigh- and High-Speed Photography and Image-based Motion Measurement; (1997) https://doi.org/10.1117/12.294524
Event: Optical Science, Engineering and Instrumentation '97, 1997, San Diego, CA, United States

Abstract

The semiconductor industry relies on digital optical imaging for the overlay metrology of integrated circuit patterns. One critical performance demand in the particular application of digital imaging is placed on the edge resolution that is defined as the smallest detectable variation of the edge image profile acquired in digital form. As the critical feature size of integrated circuit patterns reaches below 0.35 micrometers, the edge resolution is required to be less than 0.01 micrometers. This requirement is so stringent that fundamental behaviors of digital optical imaging need to be further explored especially for precision coordinate metrology. Our investigation reveals that the edge resolution shows quasi- random characteristics, not being simply deduced from relevant opto-electronic system parameters. Hence, a stochastic upper bound analysis is made to come up with the worst edge resolution that can statistically well predict actual indeterminate edge resolutions obtained with high magnification microscope objectives.

Citation Download Citation

Seung-Woo Kim, SangYoon Lee, and Jeong Kwan Lee "Statistical analysis on the measuring resolution of edge position by digital imaging", Proc. SPIE 3173, Ultrahigh- and High-Speed Photography and Image-based Motion Measurement, (12 December 1997); https://doi.org/10.1117/12.294524

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