Applications of sealed CO2 lasers for the microelectronics industry

Sri Venkat

doi:10.1117/12.309511

3 June 1998 Applications of sealed CO₂ lasers for the microelectronics industry

Sri Venkat

Proceedings Volume 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III; (1998) https://doi.org/10.1117/12.309511
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

The advent of sealed CO₂ lasers has significantly increased industrial laser applications during the last 5 years. The main advantages of this type of laser are the compact footprint, robust all-metal construction, no maintenance and low operating costs. The applications of sealed CO₂ lasers in the microelectronics industry can be broadly classified into four major categories: Ceramic Processing for Thick/Thin Films, Printed Circuit Boards and Flex Circuit Board Drilling and Routing, Solder Mask Cutting for SMT and Microwelding for the packaging industry. This paper summarizes potential applications for sealed CO₂ lasers in the microelectronics industry. Detailed process capability with speeds and thicknesses will be presented and comparisons will be made to other laser and conventional fabrication techniques.

Citation Download Citation

Sri Venkat "Applications of sealed CO₂ lasers for the microelectronics industry", Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); https://doi.org/10.1117/12.309511

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