Paper
16 April 1998 Stress analysis of piezoceramics with defects
R. K. Nimal D. Rajapakse
Author Affiliations +
Proceedings Volume 3321, 1996 Symposium on Smart Materials, Structures, and MEMS; (1998) https://doi.org/10.1117/12.305601
Event: Smart Materials, Structures and MEMS, 1996, Bangalore, India
Abstract
An accurate and efficient indirect boundary element method is presented to analyze the electroelastic fields in piezoceramics with defects in the form of voids or openings. Stress concentration around the void can be studied by using the present method for defects of arbitrary geometry and orientation. The case of multiple voids can also be analyzed without any complexity. The integral equation is based on 2D Green's functions for a piezoceramic solid under plane strain or stress conditions. Closed form solutions for Green's functions are used in this study to enhance both the numerical efficiency and accuracy. Selected numerical results for an elliptical cavity are presented. The present methodology is useful in estimating stress concentrations in piezoceramic components used in the fabrication of smart structures.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. K. Nimal D. Rajapakse "Stress analysis of piezoceramics with defects", Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); https://doi.org/10.1117/12.305601
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KEYWORDS
Chemical elements

Solids

Ferroelectric materials

Smart structures

Stress analysis

Intelligence systems

Numerical analysis

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