Paper
30 December 1999 Reticle defect size calibration using low-voltage SEM and pattern recognition techniques for sub-200-nm defects
Larry S. Zurbrick, Steve Khanna, Jay Lee, James J. Greed Jr., Ellen R. Laird, Rene M. Blanquies
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Abstract
Programmed defect test reticles are required to characterize automatic defect inspection equipment. In order to perform meaningful, quantitative comparisons between inspection systems, a precise and accurate defect sizing methodology is required. Historically, commercially available programmed defect test reticles have not had traceable or well-documented defect sizing methods nor was information regarding the precision of these measurements provided. This paper describes the methods used and results obtained from the work performed to address these issues. Using a low voltage scanning electron microscope as an image acquisition system, defect sizing is accomplished using automated pattern recognition software. The software reports defect size metrics such as maximum inscribed circle diameter and area. Measurement precision better than 30 nm has been demonstrated for the maximum inscribed circle method. The correlation of SEM based measurements to historical optical metrology measurements is also discussed.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Larry S. Zurbrick, Steve Khanna, Jay Lee, James J. Greed Jr., Ellen R. Laird, and Rene M. Blanquies "Reticle defect size calibration using low-voltage SEM and pattern recognition techniques for sub-200-nm defects", Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); https://doi.org/10.1117/12.373361
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Cited by 2 scholarly publications.
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KEYWORDS
Scanning electron microscopy

Optical testing

Reticles

LCDs

Pattern recognition

Calibration

Defect inspection

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