Fabrication of microstructures and microdevices by the particle assemblage

Mikihiko Kobayashi; Norio Shinya; Takehiro Dan; Hiroshi Fudouzi; Takeshi Konno; Mitsuru Egashira

doi:10.1117/12.436610

16 August 2001 Fabrication of microstructures and microdevices by the particle assemblage

Mikihiko Kobayashi, Norio Shinya, Takehiro Dan, Hiroshi Fudouzi, Takeshi Konno, Mitsuru Egashira

Proceedings Volume 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS; (2001) https://doi.org/10.1117/12.436610
Event: SPIE's 8th Annual International Symposium on Smart Structures and Materials, 2001, Newport Beach, CA, United States

Abstract

We aim to fabricate microstructure and microdevices by integrating and arranging powder particles, i.e., the particle assemblage. We have developed three assembling techniques of the particles. The details of the assembling techniques and samples of the assembled microstructures are introduced. A manipulator is developed to manipulate and to weld metal particles by using a tungsten probe. Nickel alloy particles of 50 micrometers were piled on a gold substrate by the manipulator, and a leaning tower of the particles is fabricated. The array of the leaning tower is considered to act as an actuator. For the integration of a great number of particles, we developed another method based on the principle with the xerography. An electron beam or an ion beam is irradiated on an insulating substrate. An electrified pattern is formed on the substrate by the doped electron or doped ion. Fine particles are attracted to the pattern by the electrostatic force. Thus, we can arrange particles by immersing the substrate in the suspension of particles. The third is a productive method of ordered mixture by the electrostatic force. A self- thermostatic heater is made from the composite particles of BaTiO₃ and In produced by the method.

Citation Download Citation

Mikihiko Kobayashi, Norio Shinya, Takehiro Dan, Hiroshi Fudouzi, Takeshi Konno, and Mitsuru Egashira "Fabrication of microstructures and microdevices by the particle assemblage", Proc. SPIE 4334, Smart Structures and Materials 2001: Smart Electronics and MEMS, (16 August 2001); https://doi.org/10.1117/12.436610

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available