Vacuum packaging of microresonators by rapid thermal processing

Mu Chiao; Liwei Lin

doi:10.1117/12.475039

11 July 2002 Vacuum packaging of microresonators by rapid thermal processing

Mu Chiao, Liwei Lin

Proceedings Volume 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology; (2002) https://doi.org/10.1117/12.475039
Event: SPIE's 9th Annual International Symposium on Smart Structures and Materials, 2002, San Diego, California, United States

Abstract

Vacuum packaging of micro resonators using TRP aluminum-to- nitride bonding has been demonstrated. Polysilicon micro resonators are fabricated with integrated sealing rings using surface micromachining technology. The top most layer on the sealing ring is silicon nitride. Aluminum sealing rings are patterned on the Pyrex glass cap wafers. The bonding and sealing of device wafer to cap wafer is done by heating the wafers in the RTP chamber at 750 degrees C for 10 seconds in vacuum. The quality factor of a vacuum- packaged micro resonator is measured as 400 +/- 50.

Citation Download Citation

Mu Chiao and Liwei Lin "Vacuum packaging of microresonators by rapid thermal processing", Proc. SPIE 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology, (11 July 2002); https://doi.org/10.1117/12.475039

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