2f method for the measurement of resonant frequency and Q-factor of micromechanical transducers

V. J. Logeeswaran; Francis E.H. Tay; M. L. Chan; Fook Siong Chau; Yung C. Liang

doi:10.1117/12.462859

19 April 2002 2f method for the measurement of resonant frequency and Q-factor of micromechanical transducers

V. J. Logeeswaran, Francis E.H. Tay, M. L. Chan, Fook Siong Chau, Yung C. Liang

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462859
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

In this paper, the response to the first harmonic component (2f) of the electrostatic force in single terminal driven electrostatic comb-drive and parallel-plate drive was used as a signal to extract device parameters, namely, the Q- factor and resonant frequency instead of the fundamental (1f) resonance response. It is shown that the difficulty in motional measurement due to electrical cross-talk (parasitics) using 1f measurement can be overcome with a higher signal-to-noise ratio of the 2f signal. Both atmospheric (low-Q) and reduced pressure environment were investigated using off-chip electronics and lock-in amplifier. The measurements were done on the electrostatic comb-drive and capacitive parallel plate sensing plates that form the two core modules of a yaw rate sensor (dual-axis resonator). The effects of AC and DC bias voltages on the measured response have been investigated. Experimental amplitude and phase response data have been analyzed using the Lorentzian curve-fit, Resonance Curve Area (RCA) method, the half-power bandwidth method (3dB) and the Nyquist plot for data fitting and determination of the Q-factor and resonance frequency.

Citation Download Citation

V. J. Logeeswaran, Francis E.H. Tay, M. L. Chan, Fook Siong Chau, and Yung C. Liang "2f method for the measurement of resonant frequency and Q-factor of micromechanical transducers", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462859

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