Paper
23 August 2002 Optical packaging activities at Institute of Microelectronics (IME), Singapore
Keng-Hwa Teo, Krishnamachari Sudharsanam, Ramana Venkata Pamidighantam, Yongkee Yeo, Mahadevan K. Iyer
Author Affiliations +
Proceedings Volume 4906, Optical Components and Transmission Systems; (2002) https://doi.org/10.1117/12.480562
Event: Asia-Pacific Optical and Wireless Communications 2002, 2002, Shanghai, China
Abstract
The development of optoelectronic components for gigabit Ethernet communications is converging towards access networks where the cost of device makes a significant impact on the market acceptance. Device fabrication and packaging cost have to be brought down with novel assembly and packaging methods. Singapore has established a reputation in semiconductor device development and fabrication with excellent process and packaging facilities. Institute of Microelectronics (IME) was founded in 1991 to add value to the Singapore electronics industry. IME is involved in the development of active and passive photonics components using Silicon and polymer materials. We present a brief report on the development activities taking place in the field of optical component packaging at IME in recent years. We present a review of our competence and some of the optical device packaging activities that are being undertaken.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Keng-Hwa Teo, Krishnamachari Sudharsanam, Ramana Venkata Pamidighantam, Yongkee Yeo, and Mahadevan K. Iyer "Optical packaging activities at Institute of Microelectronics (IME), Singapore", Proc. SPIE 4906, Optical Components and Transmission Systems, (23 August 2002); https://doi.org/10.1117/12.480562
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KEYWORDS
Packaging

Optical components

Microelectronics

Reliability

Electronics

Electro optical modeling

Optics manufacturing

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