Optical-I/O packaging technologies for chip- and board-level optical interconnects

Yuzo Ishii

doi:10.1117/12.482271

3 September 2002 Optical-I/O packaging technologies for chip- and board-level optical interconnects

Yuzo Ishii

Proceedings Volume 4907, Optical Switching and Optical Interconnection II; (2002) https://doi.org/10.1117/12.482271
Event: Asia-Pacific Optical and Wireless Communications 2002, 2002, Shanghai, China

Abstract

As silicon LSIs become more densely integrated and the bit rates between them increase, traditional printed circuit boards present problems similar to electrical cables, which are already a bottleneck to cabinet interconnection. These problems include limited line length, poor flexibility in layout design, power dissipation, and crosstalk (EMI). One promising solution to these on-board electrical interconnection bottlenecks is to use optical interconnection technology at the chip level. Making chip-level optical interconnections practical requires revolutionary changes in optoelectronics packaging; the packaging must not only keep pace with silicon LSI capabilities but should also inherit the advantages of today’s mature electronics packaging and manufacturability technologies. To meet these requirements, we developed novel optical-I/O packages for low-cost chip-to-chip optical interconnections. Unlike conventional optical packages, our packages are fully compatible with surface-mount technology (SMT) because they do not need optical connectors. The packages free users from all on-board connection work and fiber management. Using the developed optical-I/O packages, in which a VCSEL/PD array is mounted at the bottom, chip-to-chip parallel optical interconnection through a polymer waveguide array is demonstrated.

Citation Download Citation

Yuzo Ishii "Optical-I/O packaging technologies for chip- and board-level optical interconnects", Proc. SPIE 4907, Optical Switching and Optical Interconnection II, (3 September 2002); https://doi.org/10.1117/12.482271

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