Paper
24 April 2003 Fabrication of monolithic photovoltaic minimodules using bulk micromachining techniques.
Sandra Bermejo, Pablo Rafael Ortega, Luis Castaner
Author Affiliations +
Proceedings Volume 5116, Smart Sensors, Actuators, and MEMS; (2003) https://doi.org/10.1117/12.498195
Event: Microtechnologies for the New Millennium 2003, 2003, Maspalomas, Gran Canaria, Canary Islands, Spain
Abstract
In this work, a novel technology to fabricate small sized (~1cm2) c-Si photovoltaic minimodules is shown. This technology combines two main bulk micromachining techniques: fusion bonding and anisotropic etching of silicon. Due to the fact that the photovoltaic cells are fabricated in the same wafer, it is mandatory to etch the whole substrate to ensure electrical isolation. Once the individual cells are bulk-isolated they can be connected in series so as to scale up the output voltage of the miniarray. A handle wafer is required to provide mechanical stability to the device wafer. Fusion bonding is used to join the handle and the device wafer. First electrical results, under standard Air Mass 1.5 (AM 1.5) solar spectrum light (100mW/cm2), using a 9-cell serial connected minimodule, leads to a total open circuit voltage of 4.2V, a short circuit current of 2.5mA, and a maximum delivered power of 3.8mW each minimodule.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sandra Bermejo, Pablo Rafael Ortega, and Luis Castaner "Fabrication of monolithic photovoltaic minimodules using bulk micromachining techniques.", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); https://doi.org/10.1117/12.498195
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Semiconducting wafers

Silicon

Photovoltaics

Metals

Solar cells

Wafer bonding

Solar energy

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