Thermal Stress Analysis Of Brake System Components

Robert G. Dubensky; Charles C. Roberts Jr.

doi:10.1117/12.946144

20 March 1985 Thermal Stress Analysis Of Brake System Components

Robert G. Dubensky, Charles C. Roberts Jr.

Proceedings Volume 0520, Thermosense VII: Thermal Infrared Sensing for Diagnostics and Control; (1985) https://doi.org/10.1117/12.946144
Event: 1984 Cambridge Symposium, 1984, Cambridge, United States

Abstract

Rapid application of automotive brakes causes high temperatures with resulting thermal gradients. To analyze these components accurately, the inputs and heat transfer coefficients must be known. Transient thermal patterns measured on prototype parts were recorded on video tape using an infrared scanner. These temperature values were used as inputs for a finite element analysis to predict component stresses. This test series also showed that infrared thermography can be used to detect the development of thermal cracks in a component.

Citation Download Citation

Robert G. Dubensky and Charles C. Roberts Jr. "Thermal Stress Analysis Of Brake System Components", Proc. SPIE 0520, Thermosense VII: Thermal Infrared Sensing for Diagnostics and Control, (20 March 1985); https://doi.org/10.1117/12.946144

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