Paper
15 July 2004 Single-pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser
Colin J Moorhouse, Francisco Villarreal, Jozef J Wendland, Howard J Baker, Denis R Hall, Duncan P. Hand
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Abstract
CO2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm-2 for 5μm and 1500 Jcm-2 for 12μm copper thickness, using laser pulses in the 10 μs and 20 μs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Colin J Moorhouse, Francisco Villarreal, Jozef J Wendland, Howard J Baker, Denis R Hall, and Duncan P. Hand "Single-pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser", Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); https://doi.org/10.1117/12.532310
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Copper

Gas lasers

Laser drilling

Pulsed laser operation

Carbon monoxide

Cameras

Plasma

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