Low-stressed high-aspect-ratio ultrathick SU-8 UV-LIGA process for the fabrication of a micro heat exchanger

Bo Li; Quanfang Chen

doi:10.1117/12.524608

24 January 2004 Low-stressed high-aspect-ratio ultrathick SU-8 UV-LIGA process for the fabrication of a micro heat exchanger

Bo Li, Quanfang Chen

Author Affiliations +

Proceedings Volume 5344, MEMS/MOEMS Components and Their Applications; (2004) https://doi.org/10.1117/12.524608
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States

Abstract

SU-8 is an ultra-thick negative photoresist with low optical absorption in the near UV range, which makes it an ideal material for generating thick molds for electroforming as well as a structural material for MEMS devices. However, the MEMS fabrication of using SU-8 is largely limited by its well-known poor adhesion to metallic layers as well as the high internal stress induced after baking. In this paper, an optimized process for fabricating ultra-thick low stressed SU-8 mold is developed and good adhesion between SU-8 and metals is obtained by applying a newly developed material, Omnicoat from Microchem Inc. A laminated (sandwiched) micro heat exchanger has been fabricated using the developed process in which sandwiched microchannels (one layer of Ni and one layer of SU-8) has been fabricated using the patterned SU-8 and nickel electroforming process. Test results show that the micro structure fabricated can stand at cryo temperature (77K) without damages such as cracks or delamination.

Citation Download Citation

Bo Li and Quanfang Chen "Low-stressed high-aspect-ratio ultrathick SU-8 UV-LIGA process for the fabrication of a micro heat exchanger", Proc. SPIE 5344, MEMS/MOEMS Components and Their Applications, (24 January 2004); https://doi.org/10.1117/12.524608

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