Effect of thermal loading on the deformations of the optoelectronic package: a moiré interferometry approach

Arkady S. Voloshin

doi:10.1117/12.569270

25 October 2004 Effect of thermal loading on the deformations of the optoelectronic package: a moire interferometry approach

Arkady S. Voloshin

Author Affiliations +

Proceedings Volume 5595, Active and Passive Optical Components for WDM Communications IV; (2004) https://doi.org/10.1117/12.569270
Event: Optics East, 2004, Philadelphia, Pennsylvania, United States

Abstract

Advance optoelectronic packaging is dependent on the fundamental understanding of the constituent materials behavior during manufacturing and thermal cycling. Such understanding will allow increasing yield and performance of the optoelectronic packages while decreasing their cost. The combination of issues such as dimensional stability, thermal management, electrical connections, and optical access are not yet well understood. Dimensional stability of the generic optoelectronic package was studied by the in-plane moire interferometry. Using digital image analysis enhanced data processing one can get the in-plane displacement resolution of 20 nm. The 1200 l/mm grating was transferred on the test vehicle surface before it was subjected to the thermal cycling. The effect of the temperature cycling on the test vehicle integrity was analyzed by studying the relative deformation of the components. It was found that ten cycles in the range of 0° C - 100° C resulted in permanent strain of 400 μstrains at the corner of the brass post and the quartz plate. Thus, the obtained results suggest that during thermal cycling there was an irreversible deformation or slip at the corner of the brass post on the boundary with the quartz plate. The presented here methodology may be used for analysis of the various adhesives under cyclic thermal loading. The obtained data will be very useful for the design of the optoelectronic package, since it will allow for prediction of the possible misalignment and may be used for the reliability studies of the optoelectronic packages.

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Arkady S. Voloshin "Effect of thermal loading on the deformations of the optoelectronic package: a moire interferometry approach", Proc. SPIE 5595, Active and Passive Optical Components for WDM Communications IV, (25 October 2004); https://doi.org/10.1117/12.569270

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KEYWORDS

Quartz

Adhesives

Optoelectronics

Deflectometry

Thermal effects

Optical components

Fringe analysis

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