New generation of corrosion-resistant microcoolers

Thomas Ebert; Marcus Pajunk; Dirk Mueller; Wilhelm Priesterath

doi:10.1117/12.590340

17 March 2005 New generation of corrosion-resistant microcoolers

Thomas Ebert, Marcus Pajunk, Dirk Mueller, Wilhelm Priesterath

Proceedings Volume 5711, High-Power Diode Laser Technology and Applications III; (2005) https://doi.org/10.1117/12.590340
Event: Lasers and Applications in Science and Engineering, 2005, San Jose, California, United States

Abstract

Cooling high power laser diodes with micro channel heat sinks is state of the art. But latterly also states of the art are problems with leaks, based on corrosion. As a user of high power diode lasers we can badly confirm that point. We observed, that the major part of the collapsed heat sinks was made by using direct copper bonding. Due to that, ProLas decided to get forward in there own development of micro cooling systems and the protection of corrosion. In a first step the joining procedure was switched to diffusion welding. This procedure uses only a vacuum surrounding, pressure and heat, no oxygen. In a second step the micro coolers will be covered at the inside using a special gas during the aeration of the vacuum oven. This cover is only a few nm thick, so that the cooling performance will not be impaired. Additionally the cover is so stabile, that particles or cavitations are not able to destroy it. Only in a few regions of very high flow rate we still have erosion, but the passivation is not able to build a local element with the copper. So erosion will not leads to corrosion in these cases. In addition to the improved copper cooler types we developed a complete new generation of micro coolers, using alternative materials and a different manufacturing method, to achieve non-corrosive monolithic heat sinks with a more suitable CTE.

Citation Download Citation

Thomas Ebert, Marcus Pajunk, Dirk Mueller, and Wilhelm Priesterath "New generation of corrosion-resistant microcoolers", Proc. SPIE 5711, High-Power Diode Laser Technology and Applications III, (17 March 2005); https://doi.org/10.1117/12.590340

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