BSOI MOEMS

Richard R. A. Syms

doi:10.1117/12.600807

22 January 2005 BSOI MOEMS

Richard R. A. Syms

Proceedings Volume 5719, MOEMS and Miniaturized Systems V; (2005) https://doi.org/10.1117/12.600807
Event: MOEMS-MEMS Micro and Nanofabrication, 2005, San Jose, California, United States

Abstract

Micro-opto-electro-mechanical systems (MOEMS) typically require optical surfaces with high flatness and low roughness to be combined with high quality mechanical parts and low power, high force microactuators. In the past, attention has concentrated overwhelmingly on polysilicon surface micromachining, which allows an extremely flexible approach to the design of complex optical systems. However, polysilicon components typically suffer from poor surface flatness and high roughness, and lack the strength and rigidity to support and manipulate macroscopic optical components, which often have weights in the milligram range. Bonded silicon-on-insulator (BSOI) material provides an excellent alternative, allowing high optical quality to be combined with high mechanical strength. This paper will review a number of different approaches to BSOI MEMS, including deep reactive ion etching (for in-plane devices), double-sided processing (for through-wafer devices) and surface tension self-assembly (for 3D MOEMS). Applications ranging from variable optical attenuators to tunable laser systems will be described. Methods of mounting, aligning and fixing hybrid-integrated components will also be considered, together with appropriate high-force micro-actuators.

Citation Download Citation

Richard R. A. Syms "BSOI MOEMS", Proc. SPIE 5719, MOEMS and Miniaturized Systems V, (22 January 2005); https://doi.org/10.1117/12.600807

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