The path to affordable and available 640x480 uncooled FPAs

Francis P. Pantuso

doi:10.1117/12.606484

31 May 2005 The path to affordable and available 640x480 uncooled FPAs (Invited Paper)

Francis P. Pantuso

Proceedings Volume 5783, Infrared Technology and Applications XXXI; (2005) https://doi.org/10.1117/12.606484
Event: Defense and Security, 2005, Orlando, Florida, United States

Abstract

The cost of high sensitivity, high resolution, (640x480) Uncooled IR (UCIR) sensors is too high for the sensors to widely proliferate. To achieve cost reduction and production capacity goals, improvements are required in the following areas: the Read-out Integrated Circuit (ROIC), the pixel design, the Integrated Circuit Processing of MEMS structures, vacuum package design, batch assembly package processing and automated testing. The improvements result in increased yield at the wafer level, increased yield through packaging, lower labor assembly and testing costs and improved performance. A cost model will be presented to show the interrelationship of the various costs and how the reduction in cost may be achieved.

Citation Download Citation

Francis P. Pantuso "The path to affordable and available 640x480 uncooled FPAs (Invited Paper)", Proc. SPIE 5783, Infrared Technology and Applications XXXI, (31 May 2005); https://doi.org/10.1117/12.606484

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