Actively cooled SLMS technology for HEL applications

Marc T. Jacoby; William A. Goodman; Jack C. Reily; Jeffrey R. Kegley; Harlan J. Haight; John Tucker; Ernest R. Wright; William D. Hogue

doi:10.1117/12.603632

1 June 2005 Actively cooled SLMS technology for HEL applications

Marc T. Jacoby, William A. Goodman, Jack C. Reily, Jeffrey R. Kegley, Harlan J. Haight, John Tucker, Ernest R. Wright, William D. Hogue

Author Affiliations +

Proceedings Volume 5792, Laser Source and System Technology for Defense and Security; (2005) https://doi.org/10.1117/12.603632
Event: Defense and Security, 2005, Orlando, Florida, United States

Abstract

Schafer has demonstrated two different methods for actively cooling our Silicon Lightweight Mirror System (SLMS^TM) technology. Direct internal cooling was accomplished by flowing liquid nitrogen through the continuous open cell core of the SLMS^TM mirror. Indirect external cooling was accomplished by flowing liquid nitrogen through a CTE matched Cesic® square-tube manifold that was bonded to the back of the mirror in the center. Testing was done in the small 4- foot thermal/vacuum chamber located at the NASA/MSFC X-Ray Calibration Facility. Seven thermal diodes were located over the front side of the 5 inch diameter mirror and one was placed on the outlet side of the Cesic® manifold. Results indicate that the mirror reaches steady state at 82K in less than four minutes for both cooling methods. The maximum temperature difference of the eight diodes was less than 200 mK when the mirror was internally cooled and covered with MLI to insulate it from the large 300 K aluminum plate that was used to mount it.

Citation Download Citation

Marc T. Jacoby, William A. Goodman, Jack C. Reily, Jeffrey R. Kegley, Harlan J. Haight, John Tucker, Ernest R. Wright, and William D. Hogue "Actively cooled SLMS technology for HEL applications", Proc. SPIE 5792, Laser Source and System Technology for Defense and Security, (1 June 2005); https://doi.org/10.1117/12.603632

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