Enhancing silicon cutting performance by shaping the focused beam

Leonard Migliore

doi:10.1117/12.708642

13 March 2007 Enhancing silicon cutting performance by shaping the focused beam

Leonard Migliore

Proceedings Volume 6458, Photon Processing in Microelectronics and Photonics VI; 64580W (2007) https://doi.org/10.1117/12.708642
Event: Lasers and Applications in Science and Engineering, 2007, San Jose, California, United States

Abstract

Singulation of devices from processed silicon wafers has historically been accomplished by cutting with mechanical saws. Current trends toward the use of thinner wafers coated with mechanically weak dielectrics reduce the speed and quality of mechanical cutting processes. The speed of laser cutting, which has previously been too low for practical implementation, may be increased significantly by altering the beam characteristics of a frequency-tripled Nd laser to produce an elliptical focused spot. Using a commercially available laser, the cutting speed exceeded that of mechanical cutting. The fracture strength of the edges as measured by bend testing is higher for elliptical beams than for round ones.

Citation Download Citation

Leonard Migliore "Enhancing silicon cutting performance by shaping the focused beam", Proc. SPIE 6458, Photon Processing in Microelectronics and Photonics VI, 64580W (13 March 2007); https://doi.org/10.1117/12.708642

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