Reducing bubbles and particles associated with photoresist packaging materials and dispense systems

W. B. Alexander; K. T. O'Dougherty; W. Liu; H. Yan; K. Mikkelsen

doi:10.1117/12.712419

2 April 2007 Reducing bubbles and particles associated with photoresist packaging materials and dispense systems

W. B. Alexander, K. T. O'Dougherty, W. Liu, H. Yan, K. Mikkelsen

Proceedings Volume 6519, Advances in Resist Materials and Processing Technology XXIV; 651939 (2007) https://doi.org/10.1117/12.712419
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

A review of bubble energetics is presented to provide background into gas saturation and bubble formation in semiconductor resists. Nitrogen was used as a drive gas to push liquid out of several package materials versus a mechanical pump. The incorporation of dissolved gas was measured and a barrier liner was found to be superior versus a bottle with no liner. We have demonstrated that a pressure dispense package with an appropriate barrier liner provides a means to deliver lithographic chemicals and resist without the use of a mechanical pump.

Citation Download Citation

W. B. Alexander, K. T. O'Dougherty, W. Liu, H. Yan, and K. Mikkelsen "Reducing bubbles and particles associated with photoresist packaging materials and dispense systems", Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 651939 (2 April 2007); https://doi.org/10.1117/12.712419

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