Optical proximity communication

Ivan Shubin; John E. Cunningham; Xuezhe Zheng; John Simons; Dazeng Feng; Hong Liang; Cheng-Chih Kung; Mehdi Asghari; Ashok V. Krishnamoorthy

doi:10.1117/12.813415

10 February 2009 Optical proximity communication

Ivan Shubin, John E. Cunningham, Xuezhe Zheng, John Simons, Dazeng Feng, Hong Liang, Cheng-Chih Kung, Mehdi Asghari, Ashok V. Krishnamoorthy

Author Affiliations +

Proceedings Volume 7219, Optoelectronic Integrated Circuits XI; 721902 (2009) https://doi.org/10.1117/12.813415
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

We review 10Gb/sec Optical Proximity Communication realized with packaged chips that carry SOI optical waveguides and reflecting mirrors micromachined in silicon. The high precision chip to chip alignment and placement was enabled by a new packaging concept based on the co-integration of pyramidal pit features defined by anisotropic silicon etch and matching high precision micro-spheres. We support this novel packaging approach with measured optical transmission data and discuss the extent of it towards other applications of Proximity Communication.

Citation Download Citation

Ivan Shubin, John E. Cunningham, Xuezhe Zheng, John Simons, Dazeng Feng, Hong Liang, Cheng-Chih Kung, Mehdi Asghari, and Ashok V. Krishnamoorthy "Optical proximity communication", Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 721902 (10 February 2009); https://doi.org/10.1117/12.813415

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