Paper
15 May 2010 Mask cleaning process evaluation and modeling
Pavel Nesladek, Steve Osborne
Author Affiliations +
Proceedings Volume 7545, 26th European Mask and Lithography Conference; 75450J (2010) https://doi.org/10.1117/12.864335
Event: 26th European Mask and Lithography Conference, 2010, Grenoble, France
Abstract
Large error bars in cleaning experiments are commonly accepted in mask making but such errors restrict potential improvements in cleaning and restrict the uniform delivery of megasonic (MS) energy. Hence, large error limits in particle removals have an impact to operational costs based on contamination and breakage. New data handling methods are developed here, which exceed the current capability scatterometric particle measurement methods and which create a better statistical basis for interpretation. These improved data treatment methods employ subdivisions of the mask into regions as small as mm2. The effective number of runs becomes many thousands of time greater which can compensate for the small number of blanks available for tests due to restricted costs. This new technology is combined with a precise modeling of the MS tracking patterns on a plate and allows better comparisons between theoretical modeling and experimentally observed cleans. The combination of these two methods yields an improved determination of rate kinetics for particle removal. Collectively, these methods provide the basis for better interpretation of the spatial non-uniformities seen in MS spin cleaning methods with obvious consequences to manufacturing costs.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pavel Nesladek and Steve Osborne "Mask cleaning process evaluation and modeling", Proc. SPIE 7545, 26th European Mask and Lithography Conference, 75450J (15 May 2010); https://doi.org/10.1117/12.864335
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KEYWORDS
Particles

Photomasks

Process modeling

Reflectivity

Mask cleaning

Tantalum

Error analysis

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