Microstructuring and wafering of silicon with laser chemical processing

Sybille Hopman; Andreas Fell; Kuno Mayer; Andreas Rodofili; Filip Granek

doi:10.1117/12.841340

23 February 2010 Microstructuring and wafering of silicon with laser chemical processing

Sybille Hopman, Andreas Fell, Kuno Mayer, Andreas Rodofili, Filip Granek

Proceedings Volume 7585, Laser-based Micro- and Nanopackaging and Assembly IV; 75850S (2010) https://doi.org/10.1117/12.841340
Event: SPIE LASE, 2010, San Francisco, California, United States

Abstract

Laser processing is an important application for fabrication of silicon solar cells, e.g. buried contacts, laser fired contacts or edge isolation. At Fraunhofer ISE a liquid-jet guided laser is used for Laser Chemical Processing (LCP). Both the fundamentals of laser material ablation with this system and the application of various processes for solar cell fabrication are investigated. The applications are divided into two main areas: Microstructuring and deep laser cutting (wafering) of silicon substrates. Microstructuring contains the investigation and characterization of laser induced damage and selective emitter formation for n- and p-type emitters depending on laser parameters and liquid properties. One of the most important and industrially relevant topics at the moment is the formation of a selective highly doped emitter under the metal fingers of solar cells. Wafering deals with the evaluation of suitable laser parameters, adequate chemicals or chemical additives and the understanding of ablation processes by simulation and experimental work. In this presentation newest results concerning n-type doping for varying laser and liquid parameters will be presented with regard to cell efficiency and contact resistance. Furthermore a short overview of promising LCP applications will be given, e.g. p-type doping and wafering.

Citation Download Citation

Sybille Hopman, Andreas Fell, Kuno Mayer, Andreas Rodofili, and Filip Granek "Microstructuring and wafering of silicon with laser chemical processing", Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 75850S (23 February 2010); https://doi.org/10.1117/12.841340

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