Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode

Satoshi Takei; Kazuhide Mochizuki; Naoya Kubo; Yoshiyuki Yokoyama

doi:10.1117/12.924633

8 May 2012 Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode

Satoshi Takei, Kazuhide Mochizuki, Naoya Kubo, Yoshiyuki Yokoyama

Author Affiliations +

Proceedings Volume 8428, Micro-Optics 2012; 84281T (2012) https://doi.org/10.1117/12.924633
Event: SPIE Photonics Europe, 2012, Brussels, Belgium

Abstract

We present investigations of light-scattering thermal cross-link package film based on self-assembly for liquid crystal display using light emitting diode. Thermal cross-link package films based on selfassembly indicated good nano regularly-structured patterning for light-scattering, excellent environmental stability of optical parameters, and solvent intermixing resistance after thermal cross-link reaction. The developed light-scattering thermal cross-link package film-s based on self-assembly is one of the most promising processes ready to be incorporated into the mass production of patterning light-scattering optical layer for advanced liquid crystal display, organic electroluminescent display, and solar cell devices.

Citation Download Citation

Satoshi Takei, Kazuhide Mochizuki, Naoya Kubo, and Yoshiyuki Yokoyama "Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode", Proc. SPIE 8428, Micro-Optics 2012, 84281T (8 May 2012); https://doi.org/10.1117/12.924633

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