Optical transceiver ICs based on 3D die-stacking of optoelectronic devices

H. J. S. Dorren; P. Duan; O. Raz

doi:10.1117/12.2042417

8 March 2014 Optical transceiver ICs based on 3D die-stacking of optoelectronic devices

H. J. S. Dorren, P. Duan, O. Raz

Proceedings Volume 8989, Smart Photonic and Optoelectronic Integrated Circuits XVI; 898909 (2014) https://doi.org/10.1117/12.2042417
Event: SPIE OPTO, 2014, San Francisco, California, United States

Abstract

Based on Amdahl scaling of tree-networks, we show that in the next 10 years power efficiency and cost of data center communication networks have to improve with three orders of magnitude. Flattened network architectures may allow for more efficient scaling but require high-radix network switches. In turn, such switches will require opto-electronic conversion in close proximity of the switch ASIC. In this paper, we focus on three-dimensional die-stacked transceiver ICs that allow for low cost fabrication and packaging that may enable flattened network architectures based on highradix switches.

Citation Download Citation

H. J. S. Dorren, P. Duan, and O. Raz "Optical transceiver ICs based on 3D die-stacking of optoelectronic devices", Proc. SPIE 8989, Smart Photonic and Optoelectronic Integrated Circuits XVI, 898909 (8 March 2014); https://doi.org/10.1117/12.2042417

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