Paper
10 April 2014 Effects of adhesive thickness on Lamb wave generation and sensing using bonded PWASs
Md. Mazharul Islam, Haiying Huang
Author Affiliations +
Abstract
This paper presents an analytical model that simulates ultrasound generation and sensing in a slender structure using bonded piezoelectric wafer active sensors (PWAS). To account for multi-mode ultrasound generation, both the longitudinal and flexural vibrations of the slender structure were considered. The effect of adhesive thickness on the ultrasound pitch-catch signals was investigated. The simulation results predict that there exists an optimal adhesive layer thickness for both ultrasound modes. Two types of experiments were carried out to validate the simulation predictions. Quantitative agreements between simulation and measurement results were achieved.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Md. Mazharul Islam and Haiying Huang "Effects of adhesive thickness on Lamb wave generation and sensing using bonded PWASs", Proc. SPIE 9061, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2014, 90610M (10 April 2014); https://doi.org/10.1117/12.2045272
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Adhesives

Actuators

Ultrasonography

Sensors

Transducers

Waveguides

Wave sensors

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