Seamless Stitching For Large Area Integrated Circuit Manufacturing

James P. Rominger

doi:10.1117/12.968412

1 January 1988 Seamless Stitching For Large Area Integrated Circuit Manufacturing

James P. Rominger

Proceedings Volume 0922, Optical/Laser Microlithography; (1988) https://doi.org/10.1117/12.968412
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

A novel approach to printing large area integrated circuits (having a surface area larger than the nominal field and submicron geometries) through joining two or more stepped image fields was tested for feasibility. A "superfield" of 30 mm by 30 mm was printed which combined three exposures of a nominal 30 mm by 10 mm field on a lx stepper. Tapering the illumination across the common border region between the over-lapping "subfields" blended one into another. This technique also minimized the effects of misalignment and uneven exposure between fields and preserved the minimum resolution of the lens system in all areas of the stitched superfield.

Citation Download Citation

James P. Rominger "Seamless Stitching For Large Area Integrated Circuit Manufacturing", Proc. SPIE 0922, Optical/Laser Microlithography, (1 January 1988); https://doi.org/10.1117/12.968412

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